Uncooled Miniature Thermal Module for Emerging Markets

The ECONA series miniature thermal module, developed by China Moneypro, features an ultra-compact wafer-level packaged infrared detector along with essential image processing circuitry. This design enables rapid capture of thermal images and temperature distribution across a target area.
By leveraging wafer-level packaging (WLP) technology, the ECONA module achieves a highly miniaturized form factor and low production costs, while still delivering strong sensitivity and solid image quality at a budget-friendly price point. This allows users to select the optimal configuration based on specific application needs.
Designed for small-size, lightweight, and low-cost (SWaP) infrared thermal imaging applications that demand decent image quality, the ECONA series stands out with its extremely compact structure and minimal power consumption. These features make it easy to embed into various inspection tools, smart devices, security cameras, handheld thermal imagers, and mobile terminals with strict constraints on cost, size, and weight. Thanks to its well-optimized architecture, the ECONA series is widely adopted in thermal imaging scenarios such as thermography, epidemic screening, smart hardware, and AIoT.
Today, the ECONA series thermal modules are extensively used in the consumer electronics market, offering easier integration into a wide range of end products while significantly lowering customers’ overall system costs.