Uncooled Infrared Camera Core with High Performance

The MID series uncooled infrared camera core delivers versatile thermal imaging performance tailored to a broad spectrum of application scenarios. Available in resolutions including 384×288, 640×512, and the high-definition megapixel option of 1280×1024, this series allows you to select the model that best fits your specific thermal imaging needs, offering great flexibility across different use cases.
Equipped with a ceramic-packaged infrared detector, advanced signal processing circuitry, and enhanced imaging algorithms, the MID series generates clear, high-contrast thermal images. Its compact form factor and lightweight construction support demanding integration requirements, particularly where size, weight, and power consumption (SWaP) are critical.
The adoption of ceramic packaging technology not only contributes to sharp image quality but also boosts overall reliability and thermal performance. This rugged packaging ensures durability in both indoor and outdoor conditions. Ceramic packaging is currently a widely adopted solution in the market, with a mature manufacturing process similar to metal packaging. However, compared to metal packaging, ceramic technology significantly reduces detector volume and weight, which in turn minimizes the overall SWaP of the MID series thermal camera core.
Designed to accommodate everything from basic thermal inspections to advanced imaging tasks in industrial, security, and scientific fields, the MID series provides expanded options for customers across sectors such as industrial automation, intelligent surveillance, unmanned platforms, robotics, smart hardware, advanced driver-assistance systems (ADAS), and firefighting.
In sThe MID series uncooled infrared camera core delivers versatile thermal imaging performance tailored to a broad spectrum of application scenarios. Available in resolutions including 384×288, 640×512, and the high-definition megapixel option of 1280×1024, this series allows you to select the model that best fits your specific thermal imaging needs, offering great flexibility across different use cases.
Equipped with a ceramic-packaged infrared detector, advanced signal processing circuitry, and enhanced imaging algorithms, the MID series generates clear, high-contrast thermal images. Its compact form factor and lightweight construction support demanding integration requirements, particularly where size, weight, and power consumption (SWaP) are critical.
The adoption of ceramic packaging technology not only contributes to sharp image quality but also boosts overall reliability and thermal performance. This rugged packaging ensures durability in both indoor and outdoor conditions. Ceramic packaging is currently a widely adopted solution in the market, with a mature manufacturing process similar to metal packaging. However, compared to metal packaging, ceramic technology significantly reduces detector volume and weight, which in turn minimizes the overall SWaP of the MID series thermal camera core.
Designed to accommodate everything from basic thermal inspections to advanced imaging tasks in industrial, security, and scientific fields, the MID series provides expanded options for customers across sectors such as industrial automation, intelligent surveillance, unmanned platforms, robotics, smart hardware, advanced driver-assistance systems (ADAS), and firefighting.
In summary, the MID Series Infrared Camera Core offers a high-performance solution for diverse thermal imaging applications. With multiple resolution choices and a robust design, it delivers outstanding image quality and dependable operation, enabling users to make well-informed decisions based on accurate thermal data.